HDI PCB with High quality and Good Price by Hitech Circuits Co., Limited in Shenzhen China

HDI PCB with High quality and Good Price by Hitech Circuits Co., Limited in Shenzhen China

HDI pcb is the abbreviation for High Density Interconnect pcb or High Density pcb. An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. Hitech Circuits Co., Limited is a professional high density interconnect pcbs, hdi pcb board manufacturer, supplier and design company from China.

HDI board, also known as high-density interconnect board, is a type of circuit board with a relatively high distribution density using micro blind buried hole technology. HDI boards have inner and outer layers of circuits, which are connected internally through processes such as drilling and metalization inside the holes.

HDI boards are generally manufactured using the layering method, and the more layers are applied, the higher the technical level of the board. Ordinary HDI boards are basically single layer stacked, while high-order HDI uses two or more layer stacking techniques, as well as advanced PCB technologies such as stacking holes, electroplating filling holes, and laser direct drilling.

When the density of PCB increases beyond eight layers, using HDI for manufacturing will result in lower costs compared to traditional complex lamination processes. HDI board is beneficial for the use of advanced assembly technology, and its electrical performance and signal accuracy are higher than traditional PCB. In addition, HDI boards have better improvements against radio frequency interference, electromagnetic wave interference, electrostatic discharge, thermal conduction, and other factors.

Electronic products are constantly developing towards high density and precision. The so-called "high" not only improves machine performance, but also reduces the size of machines. High density integration (HDI) technology can make terminal product design more compact while meeting higher standards for electronic performance and efficiency. Currently popular electronic products, such as mobile phones, digital cameras, laptops, automotive electronics, etc., many of which use HDI boards. With the upgrading of electronic products and market demand, the development of HDI boards will be very rapid.

What is a high-density interconnection PCB board

HDI is the abbreviation of High Density Interconnection, which is a kind of technology for the production of printed circuit boards. High density interconnection PCB board is a circuit board with a relatively high line distribution density using micro-blind and buried via technology.

HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.

HDI pcb board is a compact product designed for small-capacity users.

Advantages of high-density interconnected PCB boards

It can reduce the cost of PCB: When the density of PCB increases to more than eight-layer board, it is manufactured by HDI, and its cost will be lower than that of the traditional complex pressing process.
Increase circuit density: has better interconnection than that of traditional circuit boards and parts
Conducive to the use of advanced construction technology
Have better electrical performance and signal accuracy
Better reliability
Can improve thermal properties
It can improve radio frequency interference ( RFI ), electromagnetic wave interference ( EMI ), electrostatic discharge ( ESD )
Increase design efficiency

Disadvantages of high-density interconnected PCB boards

The value of NDI impedance focuses on pattern transfer (complexity of patterns) and pattern electroplating process.
The quantity and quality are abnormal, especially the high-density circuit part of the HDI PCB board has a slower etch rate than the isolation line, which causes the isolation line to be over-etched.
When the entire HDI board is etched after electroplating, a large area of copper on the PCB circuit board will be etched away, which increases the production cost. At the same time, a large amount of copper ions enter the waste liquid after etching, causing environmental pollution and difficulty in recycling.

High-density interconnection PCB board Vs ordinary PCB board

Ordinary PCB board is mainly FR-4, which is laminated with epoxy resin and electronic grade glass cloth. Generally, traditional HDI PCB board uses backed copper foil on the outer surface, because laser drilling cannot penetrate the glass cloth, glass fiber-free backed copper foil is generally used. However, the current high-energy laser drilling machine can penetrate 1180 glass cloth. This is no difference from ordinary PCB board materials.

Applications of high-density interconnected PCB boards

While electronic design is constantly improving the performance of the whole equipment, researchers are also working hard to reduce its size. In small portable products ranging from mobile phones to smart weapons, “small” is an eternal pursuit. High-density interconnection (HDI PCB) technology can make terminal product designs more compact, while meeting higher standards of electronic performance and efficiency. HDI PCB board is widely used in mobile phones, digital cameras, MP3, MP4, notebook computers, automotive electronics, IC carrier boards and other digital products, among which mobile phones are the most widely used.

High density PCB is used extensively in applications and industries including

Cell phone
GPS
Telecom
Semiconductor
Automotive
Military
Medical
Instrumentation
Note book computers
IC Carrier board
Healthcare

If you have any needs, welcome to visit https://hitechcircuits.com/pcb-products/high-density-interconnect-pcb/ or email to sales1@hitechpcb.com.